Our experimental testing capabilities include a complete set of equipment for magnetic sensor chip design and manufacturing, such as ultra-high vacuum magnetron sputtering systems, vacuum magnetic annealing furnaces, photolithography machines, etching machines, automatic probe stations, and chip sorting machines. We conduct magnetic sensor chip R&D and mass production based on a 4-8 inch MEMS platform.

Fully Autonomous Magnetoresistive Chip Processing Capabilities:

• Edge profile control of junction areas

• Insulation via hole technology

• Single-chip full-bridge technology

We possess a complete set of AMR, GMR, and TMR chip design and manufacturing technologies, including a full magnetoresistive sensor chip production line:

• Sensitive Material Sputtering System

• Material Performance Testing System (CIPT)

• Magnetic Field Annealing Furnace System

• Wafer Processing Workshop

• Wafer Testing System

• Chip Testing System

Features: High Precision、Wide Bandwidth、Low Temperature Drift、Fully Autonomous Control